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Your search returned 7 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 1999 Volume number : 22 Issue: 02 |
Study Of The Fluxing Agent Effects On The Proerties Of No-Flow Underfill Materials For Flip-Chip Applications
(Article)
Subject:
Catalyst
,
Epoxy
,
Flip-Chip
,
Flux
Author:
S. H.
Shi
C. P.
Wong
page:
141
-
151
Visco- Elastic Plastic Properties And Constitutive Modeling Of Underfills
(Article)
Subject:
Constitutive Model
,
Flip-Chip
,
Nonlinear
Author:
Zhengfang
Qian
Jianjun
Wang
Jian
Yang
page:
152
-
157
A Novel Flip Chip Technology Using Nonconductive Resin Sheet
(Article)
Subject:
Flip Chip
,
Underfill Processing
,
Reliability
Author:
Satoshi
Ito
Masaki
Mizutani
Makoto
Kuwamura
page:
158
-
162
Development Of Reworkable Underfills, Materials, Reliability And Processing
(Article)
Subject:
Epoxy
,
Printers
,
Re-Work
Author:
Lawrence
Crane
Shu
Yang
Wayne
Johnson
page:
163
-
167
Underfill Of Flip Chip On Laminates Simulation And Validation
(Article)
Subject:
Capillary Flow
,
Flip Chip
,
Quartz
Author:
L.
Nguyen
P.
Fine
S.
Bayyuk
page:
168
-
176
Flow Characterization And Thermo-Mechanical Response Of Anisotropic Conductive Films
(Article)
Subject:
Analytical
,
Anisotropic
,
Flow Analysis
Author:
Rainer
Dudek
Bernd
Michel
Peter M.
Knoll
page:
177
-
185
A Reliable And Environmentally Friendly Packaging Technology Flip Chip Joining Using Anisotropically Conductive Adhesive
(Article)
Subject:
Anisotropically Conductive Adhesive Film
,
Flip Chip
,
Reliability
Author:
Johan
Liu
Jens
Malmodin
Zonghe
Lai
page:
186
-
190
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